导航

Electronic Packaging and Its Application

发布者:贺从愿发布时间:2015-03-14浏览次数:903


各位老师好:


本期学术论坛由Dr. Kevin Liu, P.E.主讲

 

题目:Electronic Packaging and Its Application

报告人:Dr. Kevin Liu, P.E.

时间:2015316日,星期一, 12:30

地点:院南高厅


报告摘要:

1. Introduction of Electronic Packaging

2. Levels of Electronic Packaging

Chip (IC)->Open-Frame->Module->Close-Frame-Cage->System 

3. Types of Electronic Packaging 

   1) Consumer Electronics 

   2) Industrial Electronics 

   3) RF Electronics (wireless) 

   4) Avionic (Defense &. Aerospace) Electronics 

4. Design of Electronic Packaging 

   1) Printed Circuit Board (PCB) 

   2) Interconnecting and Wire Routing 

   3) Parts &. Assembly Design 

   4) Thermal Design &. Electronic Cooling 

   5) Design for Manufacturability and Assembly (DFMI A) 

5. Thermal Analysis & Management in Electronic Packaging

6. Structural Analysis in Electronic Packaging 

7. Test & Compliance of Electronic Products


报告人简介:

Kevin Liu is a senior engineer with rich work experience. Now he works as a Sr. Project Engineer with Stanley Black & Deckerin Towson, MD. He used to work in General Dynamics, GE Aviation, Alcatel, and Bell Labs. He gained his Ph.D. in Fluid & Thermal Science from Southern Methodist University (2001-2009), Master of Sciencein Mechanical Engineering from Oregon State University (1990 – 1993), Bachelor of Sciencein Forestry Machinery, Nanjing Forestry University (1980-1984).

His current research interests are mainly in areas of control and power Module design and electronic packaging, control used in varieties of professional power tools. He has four U.S. patents awarded, and another two U.S. patents pending. He is a Registered and licensed professional engineer in the Sate of Texas.



学术论坛需要大家的关心和支持!欢迎各位老师将您自己的学术成果与教学科研经验在本论坛上与大家一同分享!也欢迎您邀请国内外专家学者及各界成功人士通过本论坛与我院师生进行广泛交流。


 谢谢大家的关注!

 周一帆


************************请硕导、博导提醒您的研究生*******************

据院有关规定:

博士、硕士研究生1个学分的必修课《学科研究动态》与院学术平台合并进行,必须听满10次并上交听课报告。博士研究生在申请答辩之前须主讲一次。另外,您的博士生开题报告会也可在本论坛上举行。